THERMOSETTING RESIN COMPOSITION, AND PREPREG, INSULATING FILM WITH SUPPORT, LAMINATE PLATE, AND PRINTED WIRING BOARD, EACH OBTAINED USING SAME

摘要

A thermosetting resin composition containing: (A) a resin composition having an unsaturated Maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.