Semiconductor apparatus, method for manufacturing the same and method for manufacturing semiconductor package

摘要

PURPOSE: A semiconductor device, a manufacturing method thereof, and a semiconductor package manufacturing method are provided to arrange a conductive capping layer on a penetration electrode, thereby preventing contamination of the surface of the penetration electrode. CONSTITUTION: A substrate in which a buried electrode is formed on a first surface is prepared. A carrier substrate is attached on the first surface of the substrate. The substrate in which the carrier substrate is attached is overturned. A second surface facing the first substrate is polished in order to form a penetration electrode(103) by exposing the lower surface of the buried electrode. A conductive capping layer(140) is arranged on the exposed lower surface of the penetration electrode. The second surface of the substrate is recessed in order to project the penetration electrode.