| 摘要 |
FIELD: electronic equipment. ^ SUBSTANCE: invention relates to electronic equipment, particularly to microwave frequency monolithic integrated circuits and can be applied to microwave frequency solid-state modules of different functional designation; the essence of the invention is as follows: at least one electronic component with outlets, mounting pads and plated through via-holes, the electronic component with outlets, mounting pads and plated through via-holes of this electronic microwave frequency device designated for the surface mounting are executed as a single crystal; at that the electronic component is formed on the face side with the preset active layer of the single crystal, the mounting pads - on its back side, plated through via-holes - inside of the single crystal; the electronic component and plated through via-holes are performed in the monolithic integrated execution, the plated through via-holes are directly connected by one end to the outlet of the electronic component and by the other end with the mounting pads. ^ EFFECT: enhancement of the technical and economic features in particular extension of the working frequencies diapason, increasing of the output power, and reliability due to the reduction of the thermal resistance, decrease of weight and dimension features, increase of the recovery rate and decrease of the production manpower effort. ^ 5 cl, 7 dwg, 1 tbl |
