发明名称 ELECTRONIC CIRCUIT BOARD, AND MANUFACTURING METHOD OF ELECTRONIC CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To improve a degree of integration of an electronic circuit board, and to prevent scrapping of a normal bare chip. SOLUTION: The electronic circuit board (1) includes a board body (2) having signal lines (2b), board side terminals (2d) formed on the ends of the signal lines (2b), and bare chip placing portions (2c), a plurality of integrated electronic elements, interconnections interconnecting the electronic elements, and chip side terminals (6a) formed on the ends of the interconnections. The electronic circuit board (1) also includes bare chips (6) fixed to the bare chip placing portions (2c), and bonding wires (7) connecting the chip side terminals (6a) of the bare chips (6) to board side terminals (2d) of the board body (2). COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008166491(A) 申请公布日期 2008.07.17
申请号 JP20060354356 申请日期 2006.12.28
申请人 HIGH ENERGY ACCELERATOR RESEARCH ORGANIZATION 发明人 MURAKAMI TAKESHI
分类号 H01L25/04;H01L21/52;H01L21/60;H01L25/18 主分类号 H01L25/04
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