发明名称 |
BONDING UNIT CONTROL UNIT AND MULTI-LAYER BONDING METHOD |
摘要 |
A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost. |
申请公布号 |
US2012031557(A1) |
申请公布日期 |
2012.02.09 |
申请号 |
US201013260041 |
申请日期 |
2010.10.27 |
申请人 |
KINOUCHI MASATO;GOTO TAKAYUKI;TSUNO TAKESHI;IDE KENSUKE;SUZUKI TAKENORI;MITSUBISHI HEAVY INDUSTRIES, LTD., |
发明人 |
KINOUCHI MASATO;GOTO TAKAYUKI;TSUNO TAKESHI;IDE KENSUKE;SUZUKI TAKENORI |
分类号 |
B29C70/68;B65C9/40 |
主分类号 |
B29C70/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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