| 摘要 |
PURPOSE: A method for coating a light emitting device is provided to minimize the loss of a material by performing a coating process of a light emitting device before a die bonding process and a wire bonding process. CONSTITUTION: Shape information and location information on an upper surface of a multi-layered semiconductor layer are detected(S12). A coating material is included to cover up the multi-layered semiconductor layer(S20). The coating material, which is included on the upper surface and lateral surface of the multi-layered semiconductor layer, is hardened at a preset thickness by selectively irradiating light to the coating material based on the detected information on the upper surface of the multi-layered semiconductor layer(S30). The coating material, which is not hardened, is removed(S40).
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