| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize a semiconductor device that is unlikely to cause packaging failures even if protective resin leaks out. <P>SOLUTION: The semiconductor device comprises: a lead frame 101; a first semiconductor element 103 mounted on the lead frame 101; a frame body 105 formed on the lead frame 101 so as to surround the first semiconductor element 103; and protective resin 107 packed in an area surrounded by the frame body 105. The lead frame 101 has an external terminal 115 projecting to the outside of the frame body 105. The external terminal 115 has a barrier portion 119 formed so as to stand up from the upper surface of the external terminal 115 in an end portion projecting from the frame body 105. <P>COPYRIGHT: (C)2012,JPO&INPIT |
