发明名称 CONDUCTIVE WIRE, MANUFACTURING DEVICE FOR CONDUCTIVE WIRE, MANUFACTURING METHOD FOR CONDUCTIVE WIRE, AND MANUFACTURING METHOD FOR WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing device that manufactures an extensible conductive wire by injecting a conductive adhesive into a fluid. <P>SOLUTION: The manufacturing device for the conductive wire 100 includes injection means 210 for injecting, in a wire shape, a mixture 110 containing conductive particles 100b and an extensible base material 100a, and heating means 220 for heating the wire-shaped mixture 110. The injection means 210 injects the wire-shaped mixture 110 into the fluid, and the heating means 220 heats the fluid so that the wire-shaped mixture 110 obtains heat from the fluid. The injection means 210 further includes adjustment means 212 for adjusting injection conditions so that the conductive particles 100b have a desired orientation. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012028051(A) 申请公布日期 2012.02.09
申请号 JP20100163455 申请日期 2010.07.20
申请人 OSAKA UNIV 发明人 SUGANUMA KATSUAKI;WAKUDA DAISUKE
分类号 H01B13/00;H01B1/00;H01B1/22;H01B5/02;H01B5/16;H05K3/10 主分类号 H01B13/00
代理机构 代理人
主权项
地址