发明名称 |
CONDUCTIVE WIRE, MANUFACTURING DEVICE FOR CONDUCTIVE WIRE, MANUFACTURING METHOD FOR CONDUCTIVE WIRE, AND MANUFACTURING METHOD FOR WIRING BOARD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing device that manufactures an extensible conductive wire by injecting a conductive adhesive into a fluid. <P>SOLUTION: The manufacturing device for the conductive wire 100 includes injection means 210 for injecting, in a wire shape, a mixture 110 containing conductive particles 100b and an extensible base material 100a, and heating means 220 for heating the wire-shaped mixture 110. The injection means 210 injects the wire-shaped mixture 110 into the fluid, and the heating means 220 heats the fluid so that the wire-shaped mixture 110 obtains heat from the fluid. The injection means 210 further includes adjustment means 212 for adjusting injection conditions so that the conductive particles 100b have a desired orientation. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012028051(A) |
申请公布日期 |
2012.02.09 |
申请号 |
JP20100163455 |
申请日期 |
2010.07.20 |
申请人 |
OSAKA UNIV |
发明人 |
SUGANUMA KATSUAKI;WAKUDA DAISUKE |
分类号 |
H01B13/00;H01B1/00;H01B1/22;H01B5/02;H01B5/16;H05K3/10 |
主分类号 |
H01B13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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