发明名称 LIQUID APPLICATION DEVICE AND LIQUID APPLICATION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a liquid application technology for a liquid material application device which accurately applies a trace amount of a liquid, the technology being suitable for, in particular, applying a liquid in an application quantity of &le;1 pL by a dispenser system. <P>SOLUTION: A liquid application device is constituted in such a manner that the inside diameter of the tip of a dispenser nozzle is made small and the pressures of gas in contact with two interfaces formed by the liquid in the nozzle are made equal to each other, thereby the liquid position at the nozzle tip is stabilized, and highly accurately controlled pulsed pressure is applied to the liquid inside the nozzle from a nozzle rear end while the liquid position at the nozzle tip is stabilized to thereby apply the liquid inside the nozzle onto a material to be coated and further the nozzle is moved upward at an adequate timing after application. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012024704(A) 申请公布日期 2012.02.09
申请号 JP20100166178 申请日期 2010.07.23
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 TSUTSUI YOSHITAKA;OTA YUICHI
分类号 B05C5/00;B05C11/00;B05C11/10;B05D1/26;G02B5/20;H01L51/50;H05B33/10 主分类号 B05C5/00
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