发明名称 PRINTED CIRCUIT BOARD ASSEMBLY SHEET AND METHOD FOR MANUFACTURING THE SAME
摘要 A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.
申请公布号 US2012033395(A1) 申请公布日期 2012.02.09
申请号 US201113189612 申请日期 2011.07.25
申请人 ISHII JUN;IHARA TERUKAZU;TERADA NAOHIRO;NITTO DENKO CORPORATION 发明人 ISHII JUN;IHARA TERUKAZU;TERADA NAOHIRO
分类号 H05K1/14;H05K3/00 主分类号 H05K1/14
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