BOND HEAD OF DIE BONDING DEVICE

摘要

The present invention pertains to a bond head of a die bonding device. A bond head of a die bonding device according to the present invention, which conveys a die to a substrate by picking up the same from a wafer, includes: a body section formed with a mount hole in the vertical direction; a collet shaft mounted to the mount hole of the body section so that the collet shaft may carry out rotation motion with respect to a vertical shaft and lifting motion in the vertical direction, and provided with a collet, to which a die is vacuum-adsorbed at a lower end; an air bearing member mounted between the inner peripheral surface of the mount hole and the collet shaft, and formed with pores, through which air supplied from the outside may flow between the inner peripheral surface of the hollow portion and the outer peripheral surface of the collet shaft, so that the air bearing member supports the collet shaft by the air injected into the pores in such a manner that the collet shaft may carry out the rotation motion and the vertical motion; and a rotation unit for allowing the collet shaft to carry out the rotation motion at a certain angle with respect to the vertical shaft.