| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sheet pasting apparatus capable of preventing an adhesive sheet from being pasted to a table of the circumference part when the adhesive sheet with high adhesiveness is pasted to a wafer. <P>SOLUTION: A sheet pasting apparatus includes: original sheet feeding means 10 for feeding an original sheet A, where a base member sheet C is provided on one face of an adhesive sheet S and a separator B is provided on the other face of the adhesive sheet S, to a wafer 3; a pasting table 57 holding the wafer 3, pasting means 56 for pasting the adhesive sheet S to the wafer 3 by pressing the original sheet A to the wafer 3; and cutting means 65 for cutting the original sheet A along the outline of the wafer 3. The original sheet feeding means is configured to include; a cutter 16 with which a cut 47 of the wafer shape is formed to the separator B of the original sheet A; and separating means 40 for separating a separator D cut by the cutter 16 from the original sheet A. After the separator D is separated using the separating means 40, the adhesive sheet S part of the original sheet A is pasted to the wafer 3. <P>COPYRIGHT: (C)2012,JPO&INPIT |
