SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To suppress leakage of sealing resin and intrusion of ambient air or moisture from a gap between a lead frame and resin.

SOLUTION: In a semiconductor device package in the present invention, a step 10 is provided on a side surface of a portion exposed at least within an opening of a resin portion 3 of lead frames 1 and 2. With the step 10, adhesion of resin to the lead frames 1 and 2 is improved and leakage of sealing resin and intrusion of ambient air or moisture from a gap between the lead frames 1 and 2 and resin can be suppressed.

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