| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cylindrical micro pattern coil having ensured productivity, in which a semiconductor is filled in an ultrafine pattern coil groove formed on a curved surface of a cylindrical substrate. <P>SOLUTION: An ultrafine pattern coil groove is formed, by means of a nano-imprint method, in a cylindrical substrate made of a resin material. Ink with particulate metal dispersed therein is burned onto an inner side of the pattern coil groove so as to form a metal film. Then, the metal film as a seed layer is plated with copper to form a pattern coil. <P>COPYRIGHT: (C)2012,JPO&INPIT |
