| 发明名称 |
CORELESS LAYER BUILDUP STRUCTURE WITH LGA AND JOINING LAYER |
| 摘要 |
A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging. |
| 申请公布号 |
US2012031649(A1) |
申请公布日期 |
2012.02.09 |
| 申请号 |
US20100764997 |
申请日期 |
2010.04.22 |
| 申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
ANTESBERGER TIMOTHY;DAS RABINDRA N.;EGITTO FRANK D.;MARKOVICH VOYA R.;WILSON WILLIAM E. |
| 分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
| 代理机构 |
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