发明名称 |
COOLING DEVICE, ELECTRONIC SUBSTRATE AND ELECTRONIC DEVICE |
摘要 |
A cooling device is provided. The cooling device is equipped with an electronic substrate on which a heating element has been mounted, and comprises a thermal diffusion unit of a plate-like shape. A front surface of the thermal diffusion unit thermally contacts a first circuit mounting surface of the electronic substrate. A rear face of the thermal diffusion unit thermally contacts a second circuit mounting surface of the electronic substrate. And, the thermal diffusion unit diffuses heat from the heating element according to vaporization and condensation principles of a refrigerant sealed therein. |
申请公布号 |
US2012033385(A1) |
申请公布日期 |
2012.02.09 |
申请号 |
US201013264793 |
申请日期 |
2010.04.16 |
申请人 |
NAGASAWA HIDEO;MOLEX INCORPORATED |
发明人 |
NAGASAWA HIDEO |
分类号 |
H05K7/20;F28D15/02;F28D15/04;H05K5/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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