发明名称 CLAMPING MECHANISM AUTOMATICALLY ADAPTABLE TO CHANGE OF THICKNESS OF PRINTED CIRCUIT BOARD
摘要 A clamping mechanism automatically adaptable to change of thickness of printed circuit board includes: a frame body having two parallel rail seats; two clamping rail members respectively mounted on the rail seats for clamping a printed circuit board, each clamping rail member including a first clamping rail and a second clamping rail spaced from each other by a clamping gap; and two adjustment units for adjusting the clamping gap of the clamping rail members. Each the adjustment unit includes: a support section mounted on the frame body to provide a support face; a connection section, one end of the connection section being affixed to the first clamping rail, the other end of the connection section being positioned above the support face; and a floating section positioned between the connection section and the support section and supported on the support face to apply a resilient support force to the connection section.
申请公布号 US2012032384(A1) 申请公布日期 2012.02.09
申请号 US20100850973 申请日期 2010.08.05
申请人 LIN CHENG-FENG;LIU CHI-TAI 发明人 LIN CHENG-FENG;LIU CHI-TAI
分类号 B23Q3/06 主分类号 B23Q3/06
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