发明名称 Acoustic Wave Device and Method for Manufacturing Same
摘要 A SAW device (1) has a substrate (3) configured to propagate acoustic waves; an IDT electrode (15) on a first main surface (3a) of a substrate (3); and an electrode pad (13) on the first main surface (3a) electrically connected to the IDT electrode (15). The SAW device (1) also has a terminal with a pillar-shape (column part (7z)) setted up on the electrode pad (13); a third conductive layer (39) extending from a side surface of the column part (7z); and a cover (5) forming a vibration space (S) above the IDT electrode (15) and covering the side surface of the column part (7z), and the third conductive layer (39).
申请公布号 US2012032759(A1) 申请公布日期 2012.02.09
申请号 US201013265527 申请日期 2010.03.19
申请人 NISHII JUNYA;NAKAI TSUYOSHI;OTSUKA KAZUHIRO;KYOCERA CORPORATION 发明人 NISHII JUNYA;NAKAI TSUYOSHI;OTSUKA KAZUHIRO
分类号 H03H9/64;B05D3/00;B05D5/12;H01L41/047 主分类号 H03H9/64
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