发明名称 |
Acoustic Wave Device and Method for Manufacturing Same |
摘要 |
A SAW device (1) has a substrate (3) configured to propagate acoustic waves; an IDT electrode (15) on a first main surface (3a) of a substrate (3); and an electrode pad (13) on the first main surface (3a) electrically connected to the IDT electrode (15). The SAW device (1) also has a terminal with a pillar-shape (column part (7z)) setted up on the electrode pad (13); a third conductive layer (39) extending from a side surface of the column part (7z); and a cover (5) forming a vibration space (S) above the IDT electrode (15) and covering the side surface of the column part (7z), and the third conductive layer (39). |
申请公布号 |
US2012032759(A1) |
申请公布日期 |
2012.02.09 |
申请号 |
US201013265527 |
申请日期 |
2010.03.19 |
申请人 |
NISHII JUNYA;NAKAI TSUYOSHI;OTSUKA KAZUHIRO;KYOCERA CORPORATION |
发明人 |
NISHII JUNYA;NAKAI TSUYOSHI;OTSUKA KAZUHIRO |
分类号 |
H03H9/64;B05D3/00;B05D5/12;H01L41/047 |
主分类号 |
H03H9/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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