| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a holding table for adhesive sheet attachment/detachment which can improve the adhesion property or peeling property of the adhesive sheet, and which can also reduce the risk of causing damage to a semiconductor wafer. <P>SOLUTION: A holding table for adhesive sheet attachment/detachment holds a wafer when attaching an adhesive sheet to the wafer and/or when peeling the adhesive sheet from the wafer attached with the adhesive sheet. The holding table for adhesive sheet attachment/detachment comprises: a holding part which has a holding surface to hold the wafer; heating means which is arranged under the holding part so as to heat the holding part; and a metal plate which is arranged between the heating means and the holding part so as to reduce the temperature variations of the holding part heated by the heating means. <P>COPYRIGHT: (C)2012,JPO&INPIT |
