| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a tape peeling device which reduces the damage of a wafer by thermo-compression bonding or the risk of damage to the wafer, and which also facilitates the disposal of a used peeling tape. <P>SOLUTION: A tape peeling device comprises: a holding table 18 for holding a plate-like object 11 attached with a protective tape 13 on its front face; pressure-bonding means 62 for pressure-bonding a peeling tape 26, which is composed of at least a base material and a adhesive layer, onto the protective tape 13 attached on the front face of the plate-like object 11; clamping means 38 for clamping an end of the peeling tape 26; and moving means for relatively displacing the clamping means 38 and the holding table 18 from each other. The clamping means 38 includes: an upper clamping part 44 and a lower clamping part 42 for clamping the peeling tape 26; and clamping part moving means for moving the upper clamping part 44 and the lower clamping part 42 in a direction to bring them closer to or further away from each other. The lower clamping part 42 includes: jetting ports opened toward the adhesive layer of the peeling tape 26 attached to the lower clamping part 42; and a transmission path for supplying gas to the jetting ports. <P>COPYRIGHT: (C)2012,JPO&INPIT |
