发明名称 |
FILM FORMING METHOD AND FILM FORMING DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film forming method capable of forming a silicon oxide film having a high density and a high stress on a workpiece surface. <P>SOLUTION: A film forming method for forming a silicon oxide film on the surface of a workpiece W in a processing container 14 comprises: an absorption step of absorbing a seed gas composed of silane-based gas to the workpiece surface by supplying the seed gas into the processing container; a film formation step of forming a silicon film to which an impurity was added by supplying a silicon-containing gas which is material gas and an additive gas including the impurity into the processing container; and an oxidation step of converting a silicon film to a silicon oxide film by oxidizing the silicon film. This forms a silicon oxidation film having a high density and a high stress on the workpiece surface. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012028741(A) |
申请公布日期 |
2012.02.09 |
申请号 |
JP20110110029 |
申请日期 |
2011.05.17 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
MURAKAMI HIROKI;HASEBE KAZUHIDE;YAMAMOTO KAZUYA;TAKAHASHI TOSHIHIKO;SUZUKI DAISUKE |
分类号 |
H01L21/316;C23C16/42;H01L21/31 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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