发明名称 FILM FORMING METHOD AND FILM FORMING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a film forming method capable of forming a silicon oxide film having a high density and a high stress on a workpiece surface. <P>SOLUTION: A film forming method for forming a silicon oxide film on the surface of a workpiece W in a processing container 14 comprises: an absorption step of absorbing a seed gas composed of silane-based gas to the workpiece surface by supplying the seed gas into the processing container; a film formation step of forming a silicon film to which an impurity was added by supplying a silicon-containing gas which is material gas and an additive gas including the impurity into the processing container; and an oxidation step of converting a silicon film to a silicon oxide film by oxidizing the silicon film. This forms a silicon oxidation film having a high density and a high stress on the workpiece surface. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012028741(A) 申请公布日期 2012.02.09
申请号 JP20110110029 申请日期 2011.05.17
申请人 TOKYO ELECTRON LTD 发明人 MURAKAMI HIROKI;HASEBE KAZUHIDE;YAMAMOTO KAZUYA;TAKAHASHI TOSHIHIKO;SUZUKI DAISUKE
分类号 H01L21/316;C23C16/42;H01L21/31 主分类号 H01L21/316
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