| 发明名称 |
SEMICONDUCTOR DEVICE BONDING MATERIAL |
| 摘要 |
Provided is a semiconductor device wherein an internal bonding section does not melt at the time of substrate mounting by means of filling the hole portions of a porous metal body having a mesh structure with an Sn or Sn-based solder alloy and using a bonding material obtained by covering the surface thereof for internal bonding of the semiconductor device. |
| 申请公布号 |
WO2012018046(A1) |
申请公布日期 |
2012.02.09 |
| 申请号 |
WO2011JP67770 |
申请日期 |
2011.08.03 |
| 申请人 |
SENJU METAL INDUSTRY CO., LTD.;SAKAMOTO YOSHITSUGU;YAMADA HIROYUKI;YAMANAKA YOSHIE;OHNISHI TSUKASA;YOSHIKAWA SHUNSAKU;TADOKORO KENZO |
发明人 |
SAKAMOTO YOSHITSUGU;YAMADA HIROYUKI;YAMANAKA YOSHIE;OHNISHI TSUKASA;YOSHIKAWA SHUNSAKU;TADOKORO KENZO |
| 分类号 |
B23K35/14;B22F3/26;B23K1/00;B23K35/26;B23K35/30;B23K35/40;B23K101/40;C22C9/02;C22C13/00;H01L21/52;H05K3/34 |
主分类号 |
B23K35/14 |
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