发明名称 ELECTRONIC DEVICE HOUSING
摘要 An electronic device housing includes a first housing and a second housing. The first housing forms a welding portion. The second housing defines a receiving groove in the periphery for receiving the welding portion. The welding portion is welded to an inner wall of the receiving groove of the second housing.
申请公布号 US2012031665(A1) 申请公布日期 2012.02.09
申请号 US20100964915 申请日期 2010.12.10
申请人 DAI BIN;SHI FA-GUANG;HON HAI PRECISION INDUSTRY CO., LTD.;FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD. 发明人 DAI BIN;SHI FA-GUANG
分类号 H05K5/00 主分类号 H05K5/00
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