| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ceramic joined body with enhanced response after voltage removal and improved sealing effect of cooling gas or heating gas between an adsorption face and a semiconductor wafer. <P>SOLUTION: A ceramic joined body comprises a joined body and a ceramic body made of ceramic. The ceramic body includes: a first surface bonded to the joined body; a second surface which is a rear face of the first surface; a through-hole which penetrates between the first surface and the second surface; and an electrode which is formed either on the first surface or inside the ceramic body. The second surface includes: a convex seal band portion which is formed continuously with the periphery of the ceramic body; an embossed pattern portion which is arranged inside the seal band portion, and which is a region provided with a plurality of protrusions having substantially the same height as that of the seal band portion; and a drop band portion which is a substantially planar region positioned between the seal band portion and the embossed pattern portion. <P>COPYRIGHT: (C)2012,JPO&INPIT |
