| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the occurence of resin unfilled areas and appearance defects. <P>SOLUTION: One or multiple through holes 6 are provided in at least one of multiple lead frames 1 and 2. When resin, which forms a mounting area of a semiconductor element and holds the lead frames 1 and 2, is poured in, this structure allows the through holes 6 to serve as resin flowing passages, and the resin is poured from back surfaces of the lead frames 1 and 2 through the through holes 6. Thus, the flowing passages of the resin are shortened, so that the occurence of resin unfilled areas and appearance defects are prevented. <P>COPYRIGHT: (C)2012,JPO&INPIT |
