发明名称 PHENOL RESIN MOLDING MATERIAL AND PHENOL RESIN MOLDED ARTICLE
摘要 <P>PROBLEM TO BE SOLVED: To provide a phenol resin molding material capable of suppressing generation of warpage or strain by reducing mold shrinkage or anisotropy without damaging heat resistance or moldability held by the phenol resin molding material, and reducing abrasiveness to a partner material on a sliding part or abrasiveness of a resin molded article itself, and to provide a phenol resin molded article molded from the molding material. <P>SOLUTION: This phenol resin molding material containing a phenol resin, a filler and a lubricating material as essential components is formed by blending the phenol resin in 10-25 mass% to the total amount of the molding material, molten silica as the filler in 10-84 mass% to the total amount of the molding material, and graphite as the lubricating material in 1-60 mass% to the total amount of the molding material. Assuming that the total of the molding material is 100 mass%, the total of the phenol resin, the molten silica and the graphite is &ge;90 mass%. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012025940(A) 申请公布日期 2012.02.09
申请号 JP20110137576 申请日期 2011.06.21
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 HIRABAYASHI TATSUO;MIYOSHI MASANORI;SUDA TATSUYA
分类号 C08L61/10;C08K3/04;C08K3/36 主分类号 C08L61/10
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