| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress occurrence of chip cracks in a semiconductor device in which a semiconductor chip including an SiC substrate is mounted on a mounting portion of Cu. <P>SOLUTION: A semiconductor device 100 comprises: a semiconductor chip 10 including an SiC substrate 12; and a mounting portion 20 made of Cu for mounting the semiconductor chip. The semiconductor chip 10 is bonded to the mounting portion 20 with an Ag paste 30 in which Ag fine particles are dispersed in a solution not containing epoxy. The Ag paste is softer than an AuSn paste and functions as a buffer material for relieving stress transferred from the mounting portion 20 of Cu to the semiconductor chip 10. Therefore, occurrence of chip cracks can be suppressed by using the Ag paste as a brazing material for fixing the semiconductor chip 10 to the mounting portion 20. <P>COPYRIGHT: (C)2012,JPO&INPIT |
