发明名称 LASER PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a laser processing method capable of forming a modified area along each cutting schedule line while preventing damage on each effective part. <P>SOLUTION: When cutting predetermined lines 51, 52, 53 are concentrated on one point towards each of adjacent three effective parts 18, modified areas 71, 72, 73 are formed in intermediate parts 51b, 52b, 53b on each of the cutting predetermined lines 51, 52, 53, and modified areas 71, 72, 73 are not formed in edge parts 51a, 52a, 53a. Thereby a generation of a crack from the modified area 71 in the vicinity of the cutting predetermined lines 52, 53 as the modified area 71 is formed along the cutting predetermined line 51, is prevented and it is prevented that a crack generated from the modified area 71 extends to the opposing effective part 18. Formation of the modified areas 72, 73 along the cutting predetermined lines 52, 53 are the same as the formation of the modified area 71. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012028452(A) 申请公布日期 2012.02.09
申请号 JP20100164066 申请日期 2010.07.21
申请人 HAMAMATSU PHOTONICS KK 发明人 SAKAMOTO TSUYOSHI
分类号 H01L21/301;B23K26/38;B23K26/40 主分类号 H01L21/301
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