发明名称 |
MICROCRYSTALLINE-TO-AMORPHOUS GOLD ALLOY AND PLATED FILM, AND PLATING SOLUTION FOR THOSE, AND PLATED FILM FORMATION METHOD |
摘要 |
Disclosed is a microcrystalline-to-amorphous gold alloy-plated film having excellent electrical properties and excellent mechanical properties. Physical properties including both the advantageous properties of a crystalline structure and the advantageous properties of an amorphous structure can be obtained by allowing a microcrystalline phase and an amorphous phase to exist in a mixed state at a specific ratio. The average particle diameter of the microcrystals is 30 nm or smaller, the volume fraction of the microcrystals is 10 to 90%, the knoop hardness is Hk 180 or more, the specific resistivity is 200μΩ-cm or less. In the film, hardness and abrasion resistance can be improved while maintaining a good specific resistivity value and chemical stability both inherent to gold at practically insignificant levels. Therefore, the film is useful as a material for connecting an electric or electronic component such as a connector and a relay.
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申请公布号 |
US2012031764(A1) |
申请公布日期 |
2012.02.09 |
申请号 |
US201013202050 |
申请日期 |
2010.02.17 |
申请人 |
OSAKA TETSUYA;OKINAKA YUTAKA;SENDA KAZUTAKA;IWAI RYOTA;KATO MASARU;KANTO KAGAKU KABUSHIKI KAISHA;WASEDA UNIVERSITY |
发明人 |
OSAKA TETSUYA;OKINAKA YUTAKA;SENDA KAZUTAKA;IWAI RYOTA;KATO MASARU |
分类号 |
C25D3/48;C25D7/00 |
主分类号 |
C25D3/48 |
代理机构 |
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