| 摘要 |
A semiconductor package is provided. The semiconductor package includes a substrate, a semiconductor device, a plurality of element contacts, a molding compound and a plurality of substrate contacts. The substrate has opposite to the first surface the first surface and the second surface. The semiconductor device is disposed on the first surface. The element contacts electrically connect the substrate and the semiconductor device. The molding compound encapsulates the semiconductor device and a portion of the molding compound is located between the semiconductor device and the first surface, wherein the molding compound includes a plurality of fillers, the fillers amount to 85-89% of the molding compound and the sizes of the fillers range between 18 and 23 micrometers. The substrate contacts are formed on the second surface. |
