发明名称 METHOD FOR DEPOSITING CYCLIC THIN FILM
摘要 Provided is a method for depositing a cyclic thin film for providing an excellent film quality and step coverage. The method for depositing a cyclic thin film according to one embodiment of the present invention comprises: a deposition step for depositing a silicon on a substrate by injecting silicon precursors inside a chamber loaded with a substrate; a first purge step for removing unreacted silicon precursors and reaction byproducts from the inside of the chamber; a reaction step for forming the deposited silicon into an insulation film having a silicon by providing a first reaction gas inside the chamber; a insulation film deposition step for repeating a second purge step for removing unreacted reaction gas and the reaction byproducts from the inside of the chamber; and a densification step for densifying the insulation film having silicon formed by providing plasma atmosphere inside the chamber.
申请公布号 WO2012018211(A2) 申请公布日期 2012.02.09
申请号 WO2011KR05650 申请日期 2011.08.01
申请人 EUGENE TECHNOLOGY CO., LTD.;KIM, HAI WON;WOO, SANG HO 发明人 KIM, HAI WON;WOO, SANG HO
分类号 H01L21/31;H01L21/205 主分类号 H01L21/31
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