| 摘要 |
Providing a semiconductor chip package with solder wettable plating, comprises: separating a semiconductor chip package from an array of packages formed in a block format; immersing the semiconductor chip package in a bath of plating solution; contacting a connecting contact pad (2) of the semiconductor chip package with conductive contact material; connecting the conductive contact material to a cathode electrical potential; connecting an anode in the bath of plating solution to an anode electrical potential; and plating the connecting contact pad. Providing a semiconductor chip package with solder wettable plating, comprises: separating a semiconductor chip package from an array of packages formed in a block format; immersing the semiconductor chip package in a bath of plating solution; contacting a connecting contact pad (2) of the semiconductor chip package with conductive contact material in the bath of plating solution; connecting the conductive contact material to a cathode electrical potential; connecting an anode in the bath of plating solution to an anode electrical potential; and plating the connecting contact pad of the semiconductor chip package. Independent claims are also included for: (1) a plating bath for providing a semiconductor chip package with solder wettable plating, comprising a tray for containing the bath of plating solution for immersing the semiconductor chip package separated from an array of packages formed in a block format, conductive contact material in the tray for contacting the connecting contact pad of the semiconductor chip package, the conductive contact material for connecting to a cathode electrical potential, and an anode in the tray for connecting to an anode electrical potential; and (2) a conductive tape, comprising a metalized backing, an adhesive disposed on the metalized backing, and many conductive particles embedded in the adhesive, where many conductive particles are electrically connected to the metalized backing. |
