| 摘要 |
<p>Provided are a method for producing a printed wiring board, on which a sophisticated circuit can be formed, without special equipment at low cost and in high yield, and a printed wiring board produced by the method. In order to address the problem, a method for forming a wiring pattern is used. This method includes forming a laminate having a conductor layer and a copper foil layer made of a non-roughened copper foil having an adhered surface of which roughness (Rzjis) is 2 µm or less and of which thickness is 5 µm or less, with an insulating layer therebetween, forming a blind via in the copper foil layer, filling the blind via by forming an electroless copper plating layer on the copper foil layer and forming an electrolyte copper plating layer such that the total thickness of the copper layers laminated on the insulating layer is 15 µm or less, and forming an etching resist layer of 15 µm or less to perform etching.</p> |
