Multi-layered laminates package and method for manufacturing the same

摘要

PURPOSE: A multi-layer laminate package and a manufacturing method thereof are provided to electrically connect a cavity layer and a non-cavity layer through a metal blind via, thereby improving electrical characteristics. CONSTITUTION: A cavity layer(110) comprises two or more first wiring layers laminated on both surfaces of a first adhesive layer. One or more first opening parts pass through inside of the cavity layer. A second adhesive layer is arranged between the cavity layer and a first non-cavity layer(120). The first non-cavity layer is welded on the lower surface of the cavity layer in order to block the lower surface of the first opening part. A first electronic component(130) is electrically connected to a second wiring layer of the first non-cavity layer exposed to the first opening part of the cavity layer. The first electronic component is installed on the first non-cavity layer within the first opening part. A first metal blind via(140) is arranged in order to electrically connect the second wiring layer of the first non-cavity layer and the first wiring layer of the lowermost cavity layer.