| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress the short circuit between adjacent wires, which would occur in the case of arranging multistage wire loops in a semiconductor device such that wires are used to electrically connect between a wiring board and a semiconductor chip mounted on a principal face of the board. <P>SOLUTION: The semiconductor device includes: a wiring board 1; a chip 3 mounted on an upper face of the wiring board; and wires 6 and 6b electrically connecting between bonding leads 2 of the wiring board 1 and bonding pads 4 of the chip 3. In the semiconductor device, the diameters of the wires 6b having the longest wire length and disposed in positions closest to corners of the chip 3 are made larger than those of the other wires 6, thereby a short circuit between the adjacent wires 6 and 6b is suppressed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
