| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package stem which can improve airtightness. <P>SOLUTION: A stem 30A comprises an eyelet body 31 having a clad material on which a first iron layer 38, a copper layer 37 and a second iron layer 36 are laminated in this order, and an open hole 35 penetrating the eyelet body 31 in a thickness direction. Leads 33a, 33b are bonded to the open hole 35 via a glass body 34 serving as an insulator. An edge portion of the copper layer 37 on the first iron layer 38 side is beveled at an inner wall of the open hole 35. <P>COPYRIGHT: (C)2012,JPO&INPIT |
