| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of forming a thin film to a film forming base material capable of adequately assuring adhesion between the thin film and the film forming base material. <P>SOLUTION: In the method of forming the thin film to the film forming base material, any of oxygen plasma treatment, ozone treatment, ultraviolet irradiation treatment is applied to a surface of the film forming base material 2 made of plastic or a material in which at least one of SiO<SB POS="POST">2</SB>and Al<SB POS="POST">2</SB>O<SB POS="POST">3</SB>is dispersed to plastic. Then, on the surface of the film forming base material 2, the thin film is formed by any of a plasma CVD method, sputtering method, and vapor deposition method. <P>COPYRIGHT: (C)2012,JPO&INPIT |
