| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer conveyance mechanism for conveying a cleaned wafer by securely sucking and holding the top surface of the cleaned wafer. <P>SOLUTION: The grinding apparatus includes grinding means, a spinner cleaning mechanism for cleaning a wafer, and a wafer conveyance mechanism. The spinner cleaning mechanism includes a spinner table for sucking and holding a wafer, and the wafer conveyance mechanism includes: a suction pad 81 for sucking and holding the top surface of the wafer; conveyance movement means for conveying the suction pad 81; suction means 80 for exerting a negative pressure to the suction pad 81; a pressure gauge 84 for detecting a negative pressure; and control means. The control means operates the suction means 80 to position the suction pad 81 to the top surface of the wafer by operating the conveyance movement means in the state where a negative pressure is exerted to the suction pad 81, delivers the wafer to the suction pad 81 by canceling the sucking and holding of the wafer if a pressure signal from the pressure gauge 84 reaches a preset pressure or lower, and conveys the wafer from the spinner table by operating the conveyance movement means. <P>COPYRIGHT: (C)2012,JPO&INPIT |
