发明名称 SURFACE ROUGHENING APPARATUS OF BUILDUP SUBSTRATE INSULATING LAYER
摘要 <P>PROBLEM TO BE SOLVED: To provide a surface roughening apparatus of a buildup substrate insulating layer in which, in a dip type insulating layer roughening process, insulating layers formed on both surfaces of a large area substrate of A3 size or above can be roughened simultaneously and uniformly at a low cost. <P>SOLUTION: Processed etching liquid in a processing tank used for roughening the surface of an insulating layer on a substrate is led into an electrolytic regeneration tank and regenerated, and then the regenerated etching liquid is returned into the processing tank and roughening is performed in the surface roughening apparatus while circulating the etching liquid. The surface roughening apparatus of a buildup substrate insulating layer is configured to include a substrate holder having a lifting mechanism and a rotary mechanism, where etching liquid is made to flow from an etching liquid supply hole toward an etching liquid discharge hole in the direction parallel with the surface of a substrate processed in the processing tank, then the substrate holder is rotated by 180 degrees or -180 degrees at a substantially constant interval. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012028375(A) 申请公布日期 2012.02.09
申请号 JP20100162720 申请日期 2010.07.20
申请人 TOPPAN PRINTING CO LTD 发明人 IKEDA KENSHIRO
分类号 H05K3/46;B29C59/00;B65G35/00;H05K3/00;H05K3/18;H05K3/38 主分类号 H05K3/46
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