摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mold device capable of supporting substrates in various models and carrying out a stripping process, and a method of cutting the substrate using the device. <P>SOLUTION: The mold device includes: a housing 110; a supporting part 134a provided in the housing 110 for supporting and fixing a panel; a cutting part 130 provided in the upper part of the housing 110 for cutting the panel disposed on the supporting part 134a along a stripping line of the panel; and a drive part 140 for driving the cutting part 130. The cutting part 130 includes a cutter 134 for cutting the stripping line, and a core block 132 for attaching the cutter 134 to the housing 110 and combining them with each other to form a structure corresponding to a gap between the housing 110 and the cutter 134. <P>COPYRIGHT: (C)2012,JPO&INPIT |