| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resist formation wiring substrate which enables a fine pitch by etching during formation of a circuit and provides an excellent manufacturing efficiency, and a method of manufacturing an electronic circuit. <P>SOLUTION: A resist formation wiring substrate has an insulating substrate, a copper foil substrate formed on the insulating substrate, and copper foil which coats at least a part of the surface of the copper foil substrate and has a coating layer containing one or more materials selected from the group consisting of platinum group metals and gold; and a resist formed on the coating layer of the copper foil. <P>COPYRIGHT: (C)2012,JPO&INPIT |
