| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a partially plating method suitable for manufacturing a metallic lid member for air tight sealing of an electronic component. <P>SOLUTION: The partially plating method comprises the steps of: forming first resists 2a and 2b on principal faces of a metal substrate 1, provided that the first resist is formed on the whole principal face on one side of the substrate, and on the other side thereof, the first resist is formed on the principal face with openings 2c provided therein; supplying an etchant to the openings 2c in the first resist to form concave parts 3 in the principal face on the other side of the metal substrate 1; forming second resists 4 on inner walls of the concave parts 3; removing the first resists 2a and 2b; attaching a plating mask sheet 5 to the principal face on the one side of the metal substrate 1; and forming a plating film 6 on a part of the principal face on the other side of the metal substrate 1 except the parts where the concave parts 3 are formed, in turn. <P>COPYRIGHT: (C)2012,JPO&INPIT |
