| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conductive thermosetting resin composition in which solder particles are melted and integrated to enable the mounting of parts by a reflow process and is good in storage stability, and to provide a method for producing the same. <P>SOLUTION: The thermosetting resin composition comprising solder particles having a melting point of ≤240°C, a thermosetting resin binder and a flux component is characterized in that the thermosetting resin binder comprises an epoxy resin and a phenolic resin curing agent, and the content of the phenolic resin curing agent is 5 to 30 mass% based on the amount of epoxy resin. The method for producing the thermosetting resin composition is characterized by mixing the solder particles having a melting point of ≤240°C, a part or all of the epoxy resin, and the flux component, and then adding and mixing the remainder of the epoxy resin and the phenolic resin curing agent. <P>COPYRIGHT: (C)2012,JPO&INPIT |
