发明名称 GROUNDING OF A SHIELD WITHIN AN IMPLANTABLE MEDICAL LEAD
摘要 Grounding of a shield that is located in an implantable medical lead may be done in many ways. The ground pathway may couple to the shield at a point that is outside of a header of an implantable medical device to which the implantable medical lead is attached. The ground pathway may couple to the shield at a point that is within the header of the implantable medical device. The ground pathway may terminate at the metal can of the implantable medical device. As another option, the ground pathway may terminate at a ground plate that is mounted to the header. The ground pathway may be direct current coupled from the shield to the can or ground plate. Alternatively, the ground pathway may include one or more capacitive couplings that provide a pathway for induced radio frequency current.
申请公布号 US2012035695(A1) 申请公布日期 2012.02.09
申请号 US201013264171 申请日期 2010.04.27
申请人 OLSEN JAMES M.;KLARDIE MICHAEL R.;STONE RICHARD T.;CAI CHAD Q.;BONDHUS SPENCER M.;CONROY MARK J.;ABRAHAM TIMOTHY R. 发明人 OLSEN JAMES M.;KLARDIE MICHAEL R.;STONE RICHARD T.;CAI CHAD Q.;BONDHUS SPENCER M.;CONROY MARK J.;ABRAHAM TIMOTHY R.
分类号 A61N1/05 主分类号 A61N1/05
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