CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

摘要

A semiconductor device (20) has a plurality of devise-side lands (23) which are asymmetrically disposed with an intersection point (B) as reference. The device-side lands (23) include 45 device-side connecting lands, and four device-side spaced lands. Each of the device-side connecting lands is mechanically connected to a printed board (10) via a connecting section (30). Each of the device-side spaced lands is mechanically spaced apart from the printed board (10).