| 摘要 |
PROBLEM TO BE SOLVED: To prevent a region near the end surface of a semiconductor substrate protected by an etching protection film from being left as etching residues on the backside of a semiconductor chip when the semiconductor substrate flip-chip bonded onto a circuit board is etched into the thin semiconductor chip. SOLUTION: On a main surface 6a of the semiconductor substrate 21, division grooves 9 defining the semiconductor chip 20 are formed and the semiconductor substrate 21 is flip-chip bonded to the circuit board 15. Then the backside 1b of the semiconductor substrate 21 is etched until the division grooves 9 appear to form the semiconductor chip 20 defined with the division grooves 9 on the circuit board 15. Parts outside the division grooves 9 are removed together with etching residues 17 remaining on the outside parts by removing the etching protection film 14. COPYRIGHT: (C)2009,JPO&INPIT
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