| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of filling metal into a penetration hole of a substrate having the penetration hole. <P>SOLUTION: The metal filling method includes: a step for preparing a joined substrate having a first substrate that is conductive at least on the surface and a second substrate having a penetration hole joined via a nonionic surfactant; a step for removing the nonionic surfactant positioned at the bottom of the penetration hole of the second substrate, which is a joined surface of the joined substrate, and for exposing the surface of the conductive first substrate positioned at the bottom of the penetration hole; and a step for filling metal into the penetration hole by applying an electric field to the conductive surface of the first substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
