A semiconductor device includes a wiring board having connection pads thereon and a semiconductor chip mounted on the wiring board. The wiring board and the semiconductor chip are covered with a sealing portion. Conductive members are extended upward from the connection pads and are exposed from the sealing portion. Rewiring lines are connected to the exposed conductive members. Land portions are arranged on the sealing portion and are electrically connected to the conductive members through the rewiring lines.
申请公布号
US2012032353(A1)
申请公布日期
2012.02.09
申请号
US201113274971
申请日期
2011.10.17
申请人
KAGAYA YUTAKA;WATANABE FUMITOMO;TAKASAKI HAJIME;ELPIDA MEMORY, INC.