发明名称 THERMAL LINK
摘要 In order to provide a method for isolating a circuit and a thermal link, wherein the link has a very low resistance and is suitable for high currents, in particular very high short load currents, and also has a high degree of reliability, in particular under difficult conditions, such as thermal and mechanical loading which lasts for a relatively long time, for example, the invention proposes that, during the phase transition of the material of the fusible element (10) from the solid to the liquid state, the volume of the fusible element (10) increases and the pressure increases and, owing to the increase in volume and the increase in pressure, the fusible element (10) is dislodged so as to break the electrical connection.
申请公布号 WO2012016882(A1) 申请公布日期 2012.02.09
申请号 WO2011EP62793 申请日期 2011.07.26
申请人 VISHAY BCCOMPONENTS BEYSCHLAG GMBH;AURICH, JOACHIM;ZUM FELDE, ULF;KRUEGER, BERND;MEX, LAURENT;WERNER, WOLFGANG 发明人 AURICH, JOACHIM;ZUM FELDE, ULF;KRUEGER, BERND;MEX, LAURENT;WERNER, WOLFGANG
分类号 H01H37/76;H01H85/06;H01H85/12 主分类号 H01H37/76
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