发明名称 CONDUCTIVE PATTERN AND MANUFACTURING METHOD THEREOF
摘要 The present invention provides a method for manufacturing a conductive pattern, comprising the steps of: a) forming a conductive film on a substrate; b) forming an etching resist pattern on the conductive film; and c) forming a conductive pattern having a smaller line width than a width of the etching resist pattern by over-etching the conductive film by using the etching resist pattern, and a conductive pattern manufactured by using the same. According to the exemplary embodiment of the present invention, it is possible to effectively and economically provide a conductive pattern having a ultrafine line width.
申请公布号 US2012031647(A1) 申请公布日期 2012.02.09
申请号 US201013148251 申请日期 2010.02.08
申请人 HWANG JI-YOUNG;HWANG IN-SEOK;LEE DONG-WOOK;PARK MIN-CHOON;LEE SEUNG-HEON;CHUN SANG-KI;SON YONG-KOO;KOO BEOM-MO;LG CHEM, LTD. 发明人 HWANG JI-YOUNG;HWANG IN-SEOK;LEE DONG-WOOK;PARK MIN-CHOON;LEE SEUNG-HEON;CHUN SANG-KI;SON YONG-KOO;KOO BEOM-MO
分类号 H05K1/00;H05K3/10 主分类号 H05K1/00
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